Download Specification

Full Flip‑Chip COB packaging technology for high stability & reliability
Nano & multi‑layer optical processing for ultra‑high contrast ratio
Wide viewing angle, DCI‑P3 wide color gamut
Built‑in dual‑system for conference & entertainment, work & leisure all‑in‑one
Ultra‑narrow bezel, 95% screen‑to‑body ratio
Magnesium‑aluminum alloy body, only 88kg total weight
Multi‑protection: moisture‑proof, dust‑proof, collision‑resistant
Modular whole‑screen transportation, fast installation, ready‑to‑use within 2 hours