Download Specification

1. Fully integrated Flip-chip COB technology forenhanced stability and reliability.
2. Nano-level multi-layer optical processing, delivering
ultra-high contrast.
3. Wide viewing angles with DCI-P3 wide color gamut
support.
4. Integrated dual-mode system for entertainment andconferencing, seamlessly balancing work and leisure.
5. Near-borderless design featuring a 95% screen-to-body ratio for
immersive viewing.
6. Premium magnesium-aluminum alloy body, achieving a lightweight
build of only 88kg.
7. Multi-layer ruggedized protection: Fully shielded against moisture,
dust,and impact.
8. Efficient modular transport: Quick-assembly design that brings you a
cinematic experience in under 2 hours.